Si + Si3N4 Wafer
Dummy Fused Silica JGS2 + Si3N4 wafer 4 inch, thickness = 500 ± 25 µm, (100), 2-side polished, + 300 nm low-stress LPCVD Si3N4 on both sides, not particles-specified (box contained a broken wafer)
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Spezifikationen:
| Artikel-Nr.: | WNS40500250X0000S302 |
| Diameter: | 4 inch (100 mm) |
| Wafer thickness tolerance: | +/- 25 µm |
| Orientation: | (100) |
| Quality: | Dummy |
| Wafer thickness: | 500 µm |
| Surface: | 2-side polished (dsp) |
| Material: | Si + Si3N4 |
| Coating thickness: | 300 |
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